HighVRAM Hardware Watch

Qwen3-VL MoE VRAM: 30B-A3B vs 235B-A22B

Short answer: Qwen3-VL’s MoE branch has two very different memory classes. The complete official Q4 paths are 19.269GB for 30B-A3B and 142.906GB for 235B-A22B after adding the Q8_0 projector. A3B and A22B describe routed computation, not the amount of model data that must be stored or placed.

Size MoE models from total artifacts, not active labels. The runtime still needs access to all expert weights. Add the separate projector, KV cache, visual-token state, runtime buffers, concurrency and per-device headroom.

Qwen3-VL 30B-A3B vs 235B-A22B

ModelComplete official Q4 + Q8 projectorComplete official Q8 + Q8 projectorOfficial BF16 weightsPractical starting tier
30B-A3B19.269GB33.196GB62.142GB32GB Q4; 48GB Q8; 80GB BF16
235B-A22B142.906GB250.692GB471.340GB192GB Q4; 320GB Q8; 640GB BF16
Exact decimal totals from official Qwen repositories. File size is not measured peak resident memory.

Active parameters are not stored-weight memory

Both official configurations declare 128 experts and select eight experts per token. Sparse routing limits which experts participate in a token’s computation, but it does not delete the other expert weights from the checkpoint. The A3B and A22B labels therefore cannot be used as 3B- or 22B-sized VRAM estimates.

Active parameters can affect compute behavior, but they do not replace direct artifact evidence. Hardware fit still depends on total weights, projector, cache, runtime implementation, vision workload, device placement and concurrency.

Cache geometry also differs

ModelLayersKV headsFP16/BF16 cache per token32K payload256K payload
30B-A3B48496KiB3GiB24GiB
235B-A22B944188KiB5.875GiB47GiB
One-sequence payload arithmetic using 128-element heads and FP16/BF16 keys and values. Runtime behavior may differ.

Native 256K context is an architecture limit, not a promise that the allocation fits beside the model. Batch size, concurrency, cache precision and multimodal tokens change observed memory.

Choose the correct deployment class

  • Choose 30B-A3B when 24GB–80GB hardware is the realistic range and the exact workload validates well enough.
  • Choose 235B-A22B only when a 143GB-class Q4 deployment and explicit multi-device engineering are acceptable.
  • Do not choose from active parameters alone: benchmark representative image, document and video tasks.
  • Do not sum board labels casually: validate model partitioning and peak memory on every device.

Detailed Qwen3-VL MoE guides

The Qwen3-VL 30B-A3B guide covers 24GB through 80GB paths, complete projector pairs and a 96KiB-per-token cache. The Qwen3-VL 235B-A22B guide sums every split file and covers 160GB through 640GB multi-device paths.

Compare the dense Qwen3-VL family, general MoE memory guide and cross-family multimodal guide.

Reproducible MoE vision test

  1. Record repository, revision, variant, all language shards, projector and checksums.
  2. Record runtime/version, MoE kernels and whether image/video inputs are actually active.
  3. Record every device, capacity, topology, parallelism mode and offload target.
  4. Record weight, projector and cache precision plus per-device placement.
  5. Fix image dimensions/count, video sampling, text allocation, output target and concurrency.
  6. Measure accelerator and system memory per device before load, after load, after vision encoding and at peak generation.
  7. Report preprocessing time, time to first token, throughput, communication/fallback behavior and errors.

Use the VRAM calculator, multi-GPU guide, workload test and benchmark submission.

Continue planning

Browse all guides and tools. Capacity fit is not a performance or quality result.

Sources and limits

Reviewed October 25, 2026. Artifact sizes and architecture fields were read from official Qwen repositories. HighVRAM has not independently benchmarked every topology, runtime, MoE kernel, variant or multimodal workload. File size is not peak resident memory.

Qwen3.5 MoE path: the 35B-A3B VRAM guide explains why 3B active parameters do not reduce stored-weight memory to a 3B model.