HighVRAM Hardware Watch

NVIDIA B300 vs AMD MI355X 288GB for Local AI

Short answer: NVIDIA B300 and AMD Instinct MI355X occupy the same marketed 288GB HBM3E, 8TB/s accelerator class, but they are not interchangeable. B300 is the CUDA/Blackwell Ultra path and NVIDIA’s HGX datasheet lists 270GB usable with 7.7TB/s and up to 1100W. MI355X is the ROCm/CDNA 4 path with 288GB, 8TB/s and a 1400W direct-liquid-cooled design. Choose the complete supported platform that runs your exact model and kernels—not the larger vendor FLOPS number.

Neither is a workstation GPU. B300 is an SXM-class Blackwell Ultra accelerator for qualified HGX/DGX systems. MI355X is an OAM accelerator for qualified liquid-cooled systems. A bare module, incomplete baseboard or unsupported server is not a usable local-AI machine.

B300 vs MI355X specifications

CharacteristicNVIDIA B300AMD Instinct MI355X
ArchitectureBlackwell UltraCDNA 4 / gfx950
Software ecosystemCUDAROCm
Headline memory288GB HBM3E tier288GB HBM3E
Conservative per-device planning270GB in NVIDIA HGX B300 datasheet288GB published
Headline bandwidthUp to 8TB/s; 7.7TB/s in HGX datasheet8TB/s
Scale-up interconnectFifth-generation NVLink, up to 1.8TB/s per GPU7 × 153.6GB/s Infinity Fabric links
Host interfacePCIe Gen 6, 256GB/sPCIe 5.0 x16
Maximum accelerator powerUp to 1100W for HGX B3001400W
Cooling/platformSXM in qualified HGX/DGX system; verify system designOAM, direct liquid cooled
Eight-device aggregate headline2.3TBAbout 2.3TB

The capacity difference hidden inside “288GB”

NVIDIA’s enterprise architecture materials describe B300 as a 288GB class accelerator, while the Blackwell Ultra datasheet lists 270GB for an individual HGX B300 GPU. AMD lists MI355X at 288GB. For boundary planning, this guide uses 270GB for B300 and 288GB for MI355X. Confirm what the exact system exposes to the runtime before purchase.

Qwen3.5-122B: one-device file fit

ArtifactFilesB300 margin at 270GBMI355X margin at 288GB
GPTQ 4-bit78.864GB191.136GB209.136GB
Q4 plus projector77.446GB192.554GB210.554GB
Official FP8127.163GB142.837GB160.837GB
Q8 plus projector130.781GB139.219GB157.219GB
Official BF16250.173GB19.827GB: tight37.827GB: still benchmark

Both hold the listed BF16 files, but neither row proves usable runtime headroom. Cache, context, concurrency, temporary buffers and multimodal processing consume memory beyond checkpoint files.

Qwen3.5-397B: one-device and multi-device boundaries

ArtifactFilesB300 at 270GBMI355X at 288GB
GPTQ 4-bit235.708GBFits by files; 34.292GB marginFits by files; 52.292GB margin
Q4 plus projector245.012GBFits by files; 24.988GB marginFits by files; 42.988GB margin
Official FP8406.152GB2 devices arithmetic minimum2 devices arithmetic minimum
Q8 plus projector422.426GB2 devices arithmetic minimum2 devices arithmetic minimum
Official BF16806.796GB3 × 270GB leaves 3.204GB; plan 43 × 288GB leaves 57.204GB; benchmark, with 4 safer

Aggregate arithmetic is not automatic pooling. The framework must shard or place weights, experts, cache and activations across separate devices. For BF16, three B300s are a file-size trap. Three MI355X devices have more aggregate margin but still require measured peak-memory evidence.

CUDA or ROCm: which should decide the purchase?

QuestionFavor B300 when…Favor MI355X when…
Exact runtime supportThe required framework, quantization and multimodal kernels are validated on Blackwell Ultra/CUDAThey are validated on gfx950/ROCm
Existing infrastructureYour deployment, operators and monitoring already target CUDA/NVLinkYour deployment is standardized on ROCm/Infinity Fabric
Capacity boundaryThe measured workload fits the system’s exposed B300 memoryThe workload benefits materially from the published 288GB per device
Power and coolingThe qualified HGX/DGX design fits the facilityA 1400W direct-liquid-cooled OAM platform fits the facility
EvidenceA representative benchmark wins on complete-system cost and throughputA representative benchmark wins on complete-system cost and throughput

Do not compare vendor tensor numbers directly

Peak figures can differ by datatype, sparsity, clock, qualification and counting convention. They do not establish tokens per second, latency, power efficiency or output quality for your model. Require the same checkpoint, precision, context, batch/concurrency, runtime settings and measurement method on both systems.

Purchase and benchmark checklist

  1. Get the exact server SKU, accelerator identity, exposed memory and supported software matrix.
  2. Confirm cooling, rack power, host CPUs, system memory, storage and networking.
  3. Record driver, CUDA or ROCm, framework, container, kernels, model revision and quantization.
  4. Record topology, per-device placement and all CPU-memory or storage offload.
  5. Measure peak device and system memory, time to first token, prompt processing, generation, throttling and wall power.
  6. Compare supported complete-system price, warranty and service—not loose-module prices.

Plan the next step

Primary sources

Capacity calculations use decimal GB. Specifications and software support can change; verify the exact qualified system before purchase.

Need the smaller cross-vendor tiers? Compare AMD MI325X 256GB with NVIDIA B200 180GB before moving to the 270GB–288GB B300/MI355X class.